ÀË Åç ¶µ ¥Ø( Item) |
ÀËÅç¤èªk(Method) |
ÀË´ú»ö¾¹(Apparatus) |
|
»É ºä °ò ªOCCL
|
1.¥~Æ[(Visual) |
¥Ø´ú |
©ñ¤jÃè |
| 2.»k¨è¯S©Ê(Etch character) |
»k¨è¦Z¥Ø´ú |
©ñ¤jÃè |
| 3.«p«×(Thickness) |
IPC-4101A |
Á³±Û´ú·L¾¹ |
4.éÖñj«×(Peel Strength)
After thermal stress
After temperature cycle |
IPC-TM-650 2.4.8 |
¸U¯à©Ô¤O¾÷ |
| 5.Ås¦±±j«×(Flexural strength) |
IPC-TM-650 2.4.4 |
¸U¯à©Ô¤O¾÷ |
6.Åé¿n¹qªý(Volume resistivity)
After moisture resistance
At elevated temperature |
IPC-TM-650 2.5.17.1 |
°ªªý§Ü¾÷
«í·Å«íÀã´X |
7.ªí±¹qªý(Surface resistivity)
After moisture resistance
At elevated temperature |
IPC-TM-650 2.5.17.1 |
°ªªý§Ü¾÷
«í·Å«íÀã´X |
| 8.¤¶¹q±`¼Æ(Permittivity)At 1MHz |
IPC-TM-650 2.5.5.3 |
°ªÀWªý§Ü´ú¸Õ»ö
«í·Å«íÀã´X |
| 9.®ø¯Ó¦]¯À(Dissipation factor At 1M Hz) |
IPC-TM-650 2.5.5.3 |
°ªÀWªý§Ü´ú¸Õ»ö
«í·Å«íÀã´X |
| 10.@¹q©·±j«×(ARC resistance) |
IPC-TM-650 2.5.1 |
Arc Resistance´ú¸Õ»ö |
| 11.¤ñ¸û©Êº|¹q«ü¼Æ(C.T.I) |
IEC-112 |
C.T.I´ú¸Õ»ö |
| 12.§l¤ô²v(Water absorption) |
IPC-TM-650 2.6.2.1 |
¹q¤l¤Ñ¥ |
| 13.°òªO»Éºäªí±²Ê«×(Surface roughness and profile
of metallic foils) |
IPC-TM-650 2.2.17A |
ªí±²Ê«×»ö |
| 14.Ås¦±«×¤Î§á¦±«×(Bow and Twist) |
IPC-TM-650-2.4.22.1 |
°ª«×³W |
| 15.¤Ø¤o¦w©w©Ê(Dimension stability) |
IPC-TM-650 2.4.39 |
¤G¦¸¤¸´ú¸Õ»ö |
| 16.½n¦VÅܧβv¡]Dimension of laminate¡^ |
IPC-MI-660 3.2 |
§ë¼v»ö |
| 17.@¿U©Ê(Flammability) |
UL-94 |
¥»¥Í¿O,©â·Ï@ |
| 18.¬Á¼þÂà¤ÆÂITg(Glass transition point) |
DSCªk |
DSC´ú¸Õ»ö |
| 19.²k¿ü@¼ö©Ê(Thermal stress) |
IPC-4101
288 ¢XC Dipping 40s |
À£¤OÁç,²k¿üÄl |
| 20.¥[±j@¼ö©Ê(Heat resistance) |
PCT-2hrs
288¢XC dipping¦Ü¤À¼h |
À£¤OÁç, ²k¿üÄl |
| 21.§Ü³Â´³¸ÕÅç(Anti measling) |
PCT-1H
260 ¢XC.dipping 15s |
²k¿üÄl |
22.Hi-Pot´ú¸Õ(Hi-Pot Test)
|
DC500V 10s |
°ªÀ£À»¬ï´ú¸Õ»ö |
|
¥b ©T ¤Æ ¤ù
PP
|
1.¾ð¯×§t¶q(RC) |
IPC-TM-650 2.3.16 |
µI¤ÆÄl |
| 2.½¦¤Æ®É¶¡(GT) |
IPC-TM-650 2.3.18 |
ºë±KùڷżöªO¾÷ |
| 3.¾ð¯×¬y¶q(RF) |
IPC-TM-650 2.3.17 |
¤p«¬¸ÕÅç¼öÀ£ |
| 4.´§µo¥÷(VC) |
IPC-TM-650 2.3.19 |
¯M½c |
| 5.°ÊÖß«× |
¨Ñ°Ñ¦Ò |
°ÊÖ߫׾÷ |