| Item |
Method | Apparatus |
| CCL | 1.Visual |
Visual
inspection |
Magnifier |
| 2.Etching character |
Etched\Visual
inspection |
Magnifier |
| 3.Thickness | IPC-4101A |
Micrometer |
|
4.Peel
Strength
After
thermal stress
At
Elevated Temperature
After Exposure to Process Solution | IPC-TM-650
2.4.8 |
Material test machine |
| 5.Flexural strength | IPC-TM-650
2.4.4 |
Material test machine |
| 6.(Volume resistivity)after
moisture resistance at elevated temperature | IPC-TM-650 2.5.17.1 | High-impedance
machine |
| 7.(Surface resistivity)after moisture resistance at
elevated temperature | IPC-TM-650 2.5.17.1 | High-impedance machine |
| 8.(Permittivity)at 1MHz | IPC-TM-650 2.5.5.3 | High frequency
impedance tester |
| 9.(Dissipation factor at 1M Hz) | IPC-TM-650
2.5.5.3 | High frequency impedance tester |
10.ARC resistance
| IPC-TM-650 2.5.1 |
Arc Resistance
tester |
| 11.C.T.I | IEC-112
| C.T.I Tester |
| 12.Water absorption |
IPC-TM-650 2.6.2.1 |
Electronic balance |
13.Surface roughness
and profile of metallic foils | IPC-TM-650 2.2.17A | Surface
roughness tester |
| 14.Bow and Twist | IPC-TM-650-2.4.22.1
| Height master |
| 15.Dimension stability | IPC-TM-650
2.4.39 | Binary tester |
|
16.Distortion
of laminate |
IPC-MI-660 3.2 |
Projector |
|
17.Flammability |
UL-94V0 |
Bunsen burner |
|
18.Glass
transition point |
DSC Method |
DSC Tester |
|
19.Thermal
stress |
IPC-4101288 ¢XC
Dipping 40s |
Pressure
cooker, Solder oven |
| 20.Heat resistance | PCT-2hrs
288¡ãC dipping to delamination | Pressure cooker, Solder oven |
| 21.Anti measling | PCT-1H260 ¡ãC.dipping 15s | Solder oven |
| 22. Hi-Pot Test | DC500V 10s | High-pressure breakdown tester |
PP | 1.RC | IPC-TM-650
2.3.16 | Incinerator |
| 2.GT | IPC-TM-650 2.3.18
| Precision thermostatic hot plate machine |
| 3.RF | IPC-TM-650
2.3.17 | Bench scale thermal compressor |
| 4.VC | IPC-TM-650
2.3.19 | Oven |
| 5.Dynamic viscosity | For reference | Dynamic
viscosity machine |
|
6.Treated
Weight |
For reference |
Electronic
balance |